The experimental and numerical study of the effect die parameters, grain size and ratio t/d on spring-back ‎in micro W-bending

Document Type : Original Article

Authors

1 Department of Mechanical Engineering, Payame Noor University of Mashhad, Mashhad, Iran

2 Department of Mechanical Engineering, University of Zabol, Zabol, Iran

3 Department of Mechanical Engineering, Science and Research, Islamic Azad University Kermanshah, Kermanshah, Iran

Abstract

Micro bending is a forming process to create bends with very small radius and it is used in the production of sensitive parts of the electronics industry. The key point of the micro bending process is the production of parts while maintaining high dimensional accuracy. One of the defects effecting the dimensional accuracy and tolerance of these parts is the spring-back phenomenon which is directly related to the parameters of the tool and the material. In the present study, the spring back behavior of C12200 copper sheet in a new W-shaped bending die has been studied. Also, the effects of process factors including punch radius, die radius and sheet thickness to grain size ratio it was analyzed using finite element simulation and experimental tests. The results showed that the highest spring back angle is obtained for the grain size of 33 µm and the lowest for the grain size of 133µm. The results showed that the best conditions in terms of reducing the spring back angle are obtained in the lowest ratio of sheet thickness to grain size.

Keywords

References

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